AIN Metallized Thin Film Data:
Square resistance: <5 mΩ/SQ
Adhesion strength: >2.5 kgf/mm2
Weldability(coated with AuSn solder): Excellent
Max. wafer size: 50mm×50mm
Min. line width: 20µm/20µm
Thin Film Metal: Ti-Pt-Au, Ti-Ni-Au etc
AIN Substrate Data:
Thermal conductivity: >170 W/M.K
Linear expansion coefficient: 4.4×10-6/℃
Density: 3.26g/cm3
Volume resistivity: >1014Ω.cm
Dielectric constant: 8.6
Dielectric loss tanδ: 3×10-4
Breakdown voltage: >15kV/mm
Folding strength: 32kgf/mm2
Surface roughness: 0.2-0.63µm
Warpage: 16.5µm /50mm
Wafer size: 160mm×90mm
Please send us your drawing of customized design products.
View Big Image